产品介绍
Event Detectors are used for reliabilitytesting of solder joints, electrical connectors, and electrical interconnectsbased on continuous, electrical resistance monitoring during accelerated agingor stress testing. New interconnect developments, such as lead-free-soldertechnology, require reliability qualification testing to avoid prematurein-field-product-failures. Event Detectors perform continuous electricalmonitoring for short-duration resistance variations on large numbers ofchannels. Event Detectors do not use channel scanning but instead performcontinuous monitoring in compliance with IPC SM 785, IPC-9701, and JESD 22-B111test standards. This type of testing is vital to interconnect-reliabilitytesting in the telecommunications, computer, automotive, aerospace, and medicalindustries.
失效检测器用于可靠性测试的焊点，电气连接器，电气互连的基础上连续，电阻检测在加速老化或压力测试。发展新的互连，如无铅焊技术，需要避免过早进行集成系统可靠性鉴定试验。失效检测器进行连续检测短期多通道电阻变化。失效检测器不使用通道扫描，而是进行连续不停顿的检测按照IPC SM785，ipc-9701，和jesd22-b111测试标准。这种类型的测试是至关重要的连接可靠性测试在通讯，计算机，汽车，航天，医药等行业。
Event Detectors support the growingneed for electrical-interconnection reliability testing including solder jointreliability testing. Electrical interconnect designs are evolving in responseto cost, density, and reliability considerations. Additionally, the operating environmentfor many electronic systems is becoming more harsh due to thermal/mechanicalcycling, shock, and vibration. Interconnect testing for reliability is a vitallink to ensuring robust electronic systems and avoiding premature systemmalfunction due to electrical interconnect failures. The growing importance ofthis type of testing has helped to make Analysis Tech a leader in packagingreliability test systems.
Event Detectors electrically monitor the testsamples to detect short duration resistance changes during accelerated aging orstress testing. Large numbers of channels are continuously monitored forsub-microsecond (to nanosecond) resistance variations under integrated softwarecontrol. This type of testing is vital to ensuring interconnect-reliability inthe telecommunications, automotive, aerospace, and medical industries. AllAnalysis Tech Event Detectors conform to JEDEC standard JESD 22-B111(dependingon settings). The STD Event Detector conforms to IPC standards IPC-SM-785 andIPC-9701 for solder joint reliability testing.
These turnkey,multi-channel systems offer:
? | A wide range of test specifications |
? | Automatic data collection and analysis |
? | Robust immunity to false failure-data |
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