Precisiondiamond scriber for manual wafer scribing
This reliableDiamond Scriber performs fast, easy and precise scribing and cutting of siliconwafers, as well as thin- and thick film ceramic and glass substrates. It formsthe grooves necessary for effective glass or ceramic cutting: shallow, even andconinuous. All essential operating parameter - the angle of the scribing tool,the scribing force, the touchdown point and the lift up point of the tool areprecisely adjustable to ensure optimal flexibility and repeatable results. Thescriber has got a rotatting X-Y table with universal vacuum chuck for any sizewafers up to 8" dia or ceramic substrates up to 8" x8 ".
The X adjustment is performed by a precision ball screw with a digital readout+/- 10 μm. The table with chuck is moveable in the Y-(scribing) direction byhand. The scribing tool touches down the substrate or wafer surface on anadjustable touchdown point and is automatically lifted after leaving thescribing area. The lift-up point is adjustable too. The lowering and lifting ofthe tool can also be performed manually. A 50x magnification Microscope withcross hair and coaxial illumination can be aligned with the trace of thediamond so that the paths of the wafer or substrate, where the cut has to beperformed, need to be aligned with the cross hair of the microscope.
Technical Data:
· for wafer size up to 8" orsubstrate size 200 x 200 mm
· X/Y adjustment by micrometer screw andX-Y table
· with vacuum chuck
· Dimension: 500x500x300mm
· Weight: 25 kg
Spare parts and accessories:
· RV-129-D Spare diamond scriber tool
· VAPU-100 Vacuum pump Ask for a video tosee how it works.
一、设备简介：
Diamond Scriber RV-129是由德国UniTemp公司生产的一种晶圆材料的切割机械，一般俗称手动划片机，可以相对精确的切割分离带有规则图形的晶圆，采用真空吸附样品工作台，划片深度可调，适合科研和小规模生产的简易手动操作机器。
二、性能指标
1. 可旋转、带真空吸附样品台，最大样品直径200mm；
2. X-Y工作台上每间隔90度备有定位V字槽；
3. 通过线性轴承的测微螺杆，精确细调角度；
4. 最小分辨率：0.006度，范围：4度；
5. 划片宽度：240 mm，划线长度：250 mm，走片精度：0.01 mm；
6. 样品厚度：≤10 mm；
7. 划片压力范围：5～581 gr可调；
8. 进刀角度：可调节；
9. 单目十字准线显微镜；
三、使用范围
可切割玻璃、陶瓷、硅片等微纳电子制造方面的多种材料，适合高校科研或小规模工业生产使用