产品介绍
Sirus T2 Table Top Reactive Ion Etch (RIE) System
The Sirus T2 Reactive Ion Etcher is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.
Applications
MEMS, Solid State Lighting, Failure Analysis, Research & Development, Pilot Line.
Fluorine Etch Processes
(SF6, CF4, CHF3, O2)
•Carbon
•Quartz
•Epoxy
•Si
•GaAs/AlGaAs
•SiO2
•InSb
•Si3N4
•Ir
•SiC
•Mo
•Ta
•Nb
•TaN
•OxyNitride
•TiW
•Polyimide
•TiN
Pr (e.g: SiLK or SU8)
•W
Tool Standard Features
•Sirus T2 reactor with 200mm bottom electrode
•System controller (includes PentiumT based computer and touch screen interface)
•Two mass flow controllers
•Automatic tuning with 13.56 MHz 600 watt RF generator
•Emergency Off system
•Automatic pressure control package (butterfly valve with capacitance manometer for pressure measurement)
•12 month limited warranty
Optional Features
•Recirculating temperature controller
•Each extra mass flow controller (4 max)
Pumps
•23.3 cfm rotary vane pump with oil filtration, demister, and Fomblin oil
•The Sirus T2 system requires a roughing pump and either a chiller or cooling water with greater than 4 M ohm resistivity
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