LOAD LOCK Chamber (option)
Chamber with front open door
Cryopump and dry pump
Multiple thermal evaporation sources or OLED sources
Max. 6” substrate
Substrate rotation
Substrate bias (option)
Ion source for substrate cleaning (option)
Substrate heating to 1000C (option)
Crystal rate monitor and film thickness control
Manual or automatic system control
For deposition of metal, semiconductor and insulation materials
For deposition of multi-layer or alloy film
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