Over View and
Application DE4500 Magnetron Sputter and
Evaporation Thin Film Deposition System is assembled with world wide known
components including sputtering chamber, e-beam evaporation and thermal
evaporation chamber and load lock chamber, it can be used to sputter/evaporate
metals, semiconductor or insulation materials for single or multi layer film, it
is the ideal tools for thin film R&D for the university and
academy Features: Sample can be transferred between
sputter, evaporation and load lock chamber under vacuum Good Film Uniformity and
repeatability Safety interlock for critical
components Configuration 1. Magnetron Sputtering
Unit Magnetron Sputter
Chamber | D shape, 304 stainless steel
chamber with viewport | Vacuum Pumping | Turbo pump and rough
pump | Vacuum Valve | Pneumatic operation high vacuum and
isolation gate valves Chamber Vent Valve, Rough and
Foreline angle valve, and gas valve | Vacuum
Gauging | Wide range vacuum gauge and Pirani rough
gauge | Sputtering Sources | Three 2” or 4” circle magnetron
sputtering sources Each source with Pneumatic
shutter The power supply can be DC, pulse
DC or RF power supply | Sample Stage | Substrate Z lift motion, rotating,
and the sample heating, bias for up to 4” substrate with Pneumatic substrate
shutter | Pressure Control | Four Mass flow
controller Capacitance manometer for sputter
process pressure control | Cooled Water Interlock | There are cooled water flow sensors of interlock to
protect sputter sources work
properly |
Specification The Base Vacuum Pressure in Sputter
Chamber | better than 5E-8
Torr | Sample Loading
Capacity | Max. 4 inch flat
substrate | The Max. Temperature of the Sample
Heater | 1000C degree | The film
uniformity | better than +/-3% over a rotating 4
inch Silicon wafer | General Sputtering
Pressure | 1-5
mTorr |
2. Thermal Evaporation
Unit Evaporation
Chamber | D shape, 304 stainless steel
chamber with viewport | Vacuum Pumping | Turbo pump and rough
pump | Vacuum Valve | Pneumatic operation high vacuum and
isolation gate valves | Vacuum
Gauging | Wide range vacuum gauge and Pirani rough
gauge | Evaporation Sources | One 6 x 7cc rotary e-beam
evaporation source Source with Pneumatic
shutter With high voltage power supply and
beam sweep controller Three high temperature/OLED source
for metal or OLED evaporation | Sample Stage | Substrate Z lift motion, rotating,
and the sample heating, for up to 4” substrate with Pneumatic substrate
shutte | Thin Film
Monitor and Control | Inficon QuThin Film Deposition Rate/Thickness
monitor/control | Cooled Water Interlock | There are cooled water flow sensors of interlock to
protect e-beam sources work
properly |
Specification The Base Vacuum Pressure in Sputter
Chamber | better than 5E-8
Torr | Sample Loading
Capacity | Max. 4 inch flat
substrate | The Max. Temperature of the Sample
Heater | 600C | The film
uniformity | better than +/-3% over a rotating 4
inch Silicon wafer |
3. Load Lock
Unit Load Lock Chamber | Base Vacuum Pressure is better than 5E-7
torr Single or multi substrate loading
stage Auto sample transfer between three
chamber Option O2 reactive, Option RF plasma cleaning, Optional Heating of the
substrate |
|
来宝会员